11.01.2021 | Technical topic

Layout Tipps & Tricks

Layout Tipps & Tricks

Anbindung von SMT Bauteilen

Connection of SMT components

The connection of pads to tracks should never be made over the entire surface or over wide tracks, unless this is electrically or thermally absolutely necessary.

On the one hand, this can lead to a "lean" solder joint and, on the other hand, to defective solder joints (tombstoning) due to increased heat dissipation (heat sink). This can be especially critical with BGAs, since their solder joints can only be inspected and detected by X-ray analysis.

NOTE: The smaller the component, the more critical these negative effects are.

1 ... Nominal pad area
2 ... Connection with a trace
3 ... Connection with three tracks --> double the area with the same paste volume!


Weitere Tipps und Tricks aus 30 Jahren Erfahrung in der Elektronikproduktion finden Sie in unserem  EMS Design Guide. Unser praktisches kleines Helferlein ist bereits in 3. Auflage erschienen. Sichern Sie sich gleich eines der limitierten Exemplare! Klicken Sie hier für die Bestellung .



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