Our machinery at Ginzinger

3D-AOI measures every visible solder joint and component in three dimensions and objectively. This results in verifiable quality rather than subjective visual assessments. Defects are detected more quickly, reliably, and consistently. This improves functionality and service life while reducing customer complaints.

First, it checks whether all components are present. It also verifies their size, position, and offset. Optionally, coplanarity or markings can also be checked. In addition, the AOI inspects all visible solder joints. Depending on the geometry, 2D, 3D, or combined inspection methods are used for this purpose.

Yes, AOI detects drift trends before defects occur. This allows processes to be adjusted more quickly and helps prevent failures in downstream inspections or in the field.

In theory, chip sizes starting at 008004 (0.25 x 0.125 mm) can be inspected. This makes AOI well-suited for the miniaturization of the future. In practice, robust and efficient inspections have proven effective for chip sizes starting at 0402. This is because the smaller the components, the more complex the parameterization becomes, and false detections occur more frequently.

Yes. AOI detects missing, misaligned, or lifted components, as well as inadequate solder joints, at an early stage. This reduces the risk of hidden defects and subsequent equipment failures, which in turn reduces customer complaints and safeguards product quality.

3D-AOI measures components and solder joints volumetrically rather than relying solely on grayscale images. This allows for much more precise detection of heights, shapes, and complex contours. Simply put: 2D sees a silhouette, while 3D sees the entire structure. In addition, a 3D system can also perform traditional 2D analyses.

The 3D AOI system provides objective feedback on component placement and soldering, particularly during prototype and initial production runs. As a result, new products achieve a consistent level of quality more quickly and can be brought into mass production with greater confidence.

Yes. The system can document inspection points, including measurement values and images. This makes it possible to verify that assemblies are manufactured in accordance with specifications. This is particularly important for industries such as automotive, medical technology, and manufacturing. However, it is important to note the high storage requirements: The long-term archiving of large amounts of data incurs additional costs.

Although AOI incurs additional inspection costs, it simultaneously reduces rework, scrap, manual visual inspections, and field complaints. In many applications, the cost of inspection is therefore quickly recouped and helps ensure consistently high product quality.

Yes. Today, a basic test program for new assemblies can be created with the help of AI. Existing test programs and empirical data can also be reused. This makes it cost-effective to test even small quantities and prototype runs.

Challenging inspection conditions arise where visual contrasts are low. For example, on black components on black solder resist or on highly reflective surfaces. Very high component densities that cause shading also make inspection more difficult.

AOI can only inspect what is visually visible. Hidden solder joints—such as those found in BGAs or LGAs—can only be inspected to a limited extent, if at all. Furthermore, the inspection limits depend heavily on the layout, package density, component geometry, and PCB design. The goal is always to find the optimal balance between high defect detection and as few false positives as possible.