EXTRACT FROM OUR PRODUCTION
SMD pick-and-place machines Samsung SM320+SM321
- component spectrum min. 0201, max QFP (d=42mm)
- mounting accuracy +/- 50 µm
- printed board dimensions 50x50 mm to 460x300 mm
- printed board thickness max. 4mm
AOI (Automatical Optical Inspection) OptiCon Advanced Line 1M
- laser high- and coplanarity measuring for BGA's, connectors, etc
- diagonal view camera for PLCC, MLQP, pin liftings, etc
wafer soldering machine ERSA Powerflow N2
- max. printed board dimensions 400x320 mm
screenprint machine EKRA
- max. printable dimensions 400 x 300 mm
- InLine
- 100% soldering paste inspection after the print
- vacuum undersurface cleaning
- quick strech system LTC
blank separating machine Mutronic Diacut
- sawing for a gentle separating
EXTRACT FROM OUR DEVELOPMENT/INSPECTION EQUIPMENT DIVISION
ICT/FKT test system digitaltest MTS300
- analog In-Circuit-Test
- digital In-Circuit-Test
- Vectorless Test (OpensCheck)
- function test
